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Ceuta NS160 FR4 Epoxy board
Category:
CeutaGlass fiber board
Product Description
NS-160 Epoxy glass cloth laminated board (FR-4)
Product Description:
The NS-160 series epoxy glass cloth laminate is a plate-like FR-4 insulation material made of epoxy resin pre impregnated glass cloth and pressed at high temperature NS-160 belongs to UL94 V-0 grade high heat resistant composite materials, composite with relevant product specifications such as NEMA FR-4, MIL-I-24768/27 GEE-F, and IEC 60893 EPGC202:
Product advantages:
· Has high mechanical strength at high temperatures.
· Excellent insulation performance under high humidity.
· Excellent electrical performance in ordinary dry environments
· Maximum long-term operating temperature 130°C
· Excellent heat resistance, insulation level B
· Meets UL94 V-0 flame retardant standard
· High cost-effectiveness of products
Product application:
Industrial machinery, machine components, electrical wires, mechanical wires, bearings, gaskets, gears, washers, computer electronic equipment, carriers, electrical boards, circuit board fixing parts, wave soldering brackets, fins, converters, wiring boards, heterosexual parts, transformers, wear-resistant bars, etc
Product specifications
Metric:
·Thickness: 0.1mm~100mm or customized by the customer
·Thickness: 0.004 "~4" (NEMA standard thickness) or customized by the customer. Dimensions: 40 "x48", 48 "'x96", up to 48 "x120"
English:
·Thickness: 0.004 "~4" (NEMA standard thickness) or customized by the customer
·Dimensions: 40 "x48", 48 "'x96", maximum up to 48 "x120"
| Product parameters | ||||
| Test items | Test conditions | Unit | Typical value | |
| Voltage withstand strength | Z-direction | C-90/20/65 15 | KV/mm | 54 |
| X. Y-direction | 0-0.5/90 | KV | 28 | |
| insulation resistance | Original sample | C-90/20/65 | MΩ | 10⁶-10⁸ |
| After cooking | C-90/20/65+D-2/ 100 | MΩ | 10⁴-10⁶ | |
| Volumetric resistance | C-96/35/90 | MΩ-cm | 10⁷-10⁹ | |
| Surface resistance | C-96/35/90 | MΩ | 10⁶-10⁸ | |
| Dielectric constant (1MHz) | Fluid cell | 4.2-4.7 | ||
| Dielectric loss (1MHz) | Fluid cell | 0.030-0.035 | ||
| Arc resistance | ASTM D495 | Sec | 120-140 | |
| Leakage trace index | ASTM D3638 | V | 175-250 | |
| bending strength | Y -Direction | ASTM D790 | MPa | 400-500 |
| X-Direction | MPa | 450-550 | ||
| compressive strength | Y-Direction | ASTM D695 | MPa | 345-440 |
| X-Direction | MPa | 290-390 | ||
| tensile strength | ASM D882 | MPa | 250-350 | |
| Bending modulus | ASTM D790 | MPa | 21560-24500 | |
| Interlayer bonding force | D-48/50 | kN | 8.0-10.0 | |
| Rockwell hardness | ASTM D785 | HR-R A | 120-125 | |
| Notch impact strength | X-axis | ASTM D256 | J/cm | 5.4-6.4 |
| Glass transition temperature | DSC | IPC-TM-650 2.4.25 | C | 135 |
| Water absorption | 1.0mm thickness | E-24/50+D-24/23 | % | 0. 1-0.8 |
| proportion | As received | g/cm3 | 2.0±0.15 | |
| Coefficient of thermal expansion | X,Y-Direction | RT〜200C | PPM/C | 11-14 |
| Z -Direction | RT〜135C | PPM/C | 45-50 | |
| 135-2OOC | PPM/C | 250-260 | ||
| Flame retardancy | UL94 | Rating | V-0 | |
| Relative Temperature Index (RTI) | UL94 | C | 130 | |
| Heat resistance | 130C/2Hr | pass | ||
| 280C/30S | Pass | |||
| Insulation level | IEC 60216- 1 | Class | B | |
| Note: The above test data are typical test values and are not guaranteed specification values | ||||
| Characteristics & Applications | For template test PCB & ICT applications. | ||
| Colour | Green | ||
| Standard Sheet Size (mm) | 1020*1220 | ||
| Specific Gravity (g/cm 3) | 2.1~2.15 | ||
| Volume Resistivity M Q *cm | C-96/35/90 ≥1.0X10⁶ | ||
| Volume Resistivity M Q *cm | 150℃ ≥1.0x10⁴ | ||
| Surface Resistivity MQ | C-96/35/90 ≥l.OxlO⁴ | ||
| Surface Resistivity MQ | 150℃ | ≥l.OxlO⁴ | |
| Resistance S | D-48/50+D-0.5/23 ≥60 | ||
| Dielectric breakdown KV | D-48/50+D-0.5/23 ≥40 | ||
| Dielectric constant( 1 MHz) | ≤5.4 | ||
| Dielectri Factorf l MHz) | 1MHzC-24/23/50 <0.035 | ||
| Water Absorption | E-1/105+D-24/23 ≤0.8% | ||
| Insulation Resistance | C-90/20/66 | 10¹⁰~10¹⁴Ω | |
| FlexuralStrength | LW | A ≥415 N/mm2 | |
| CW | A ≥345 N/mm2 | ||
| Comparative Tracking Index V | IEC60112 | ≥175 | |
| Thermal Stress | Unetched Etched | 160℃,10S/solderdip No delamination | |
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