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Application of Mold Insulation Plate in Electronic Packaging Industry
Time:
2024-12-12 17:00
In electronic encapsulation molds, such as semiconductor encapsulation molds, precise control of mold temperature is required. Because the encapsulation process of material curing and other processes are very sensitive to temperature, the use of mold insulation board can provide a stable temperature environment to ensure the quality and reliability of encapsulation, to ensure the performance and life of electronic products.
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